APA (7th ed.) Citation

Dev, A., Tandon, S., Jha, P., Singh, P., & Dutt, A. (2020). Investigation of process parameters in electroless copper plating on polystyrene. Sādhanā: Academy Proceedings in Engineering Sciences, 45(1), 1. https://doi.org/10.1007/s12046-020-01377-3

Chicago Style (17th ed.) Citation

Dev, Atul, Smriti Tandon, Pankaj Jha, Prithipal Singh, and Anup Dutt. "Investigation of Process Parameters in Electroless Copper Plating on Polystyrene." Sādhanā: Academy Proceedings in Engineering Sciences 45, no. 1 (2020): 1. https://doi.org/10.1007/s12046-020-01377-3.

MLA (9th ed.) Citation

Dev, Atul, et al. "Investigation of Process Parameters in Electroless Copper Plating on Polystyrene." Sādhanā: Academy Proceedings in Engineering Sciences, vol. 45, no. 1, 2020, p. 1, https://doi.org/10.1007/s12046-020-01377-3.