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Mathematical modelling of power skiving for general profile based on numerical enveloping.

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Title: Mathematical modelling of power skiving for general profile based on numerical enveloping.
Authors: Jia, Kang1,2,3 (AUTHOR), Guo, Junkang1,3 (AUTHOR), Ma, Tao2 (AUTHOR), Wan, Shaoke1,3 (AUTHOR) skwan2020@xjtu.edu.cn
Source: International Journal of Advanced Manufacturing Technology. Sep2021, Vol. 116 Issue 1/2, p733-746. 14p.
Database: Academic Search Ultimate
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  Data: Mathematical modelling of power skiving for general profile based on numerical enveloping.
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Sep2021, Vol. 116 Issue 1/2, p733-746. 14p.
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s00170-021-07485-6
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 733
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      – TitleFull: Mathematical modelling of power skiving for general profile based on numerical enveloping.
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            NameFull: Jia, Kang
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            NameFull: Guo, Junkang
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            NameFull: Ma, Tao
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            NameFull: Wan, Shaoke
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            – D: 01
              M: 09
              Text: Sep2021
              Type: published
              Y: 2021
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              Value: 02683768
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              Value: 116
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              Value: 1/2
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            – TitleFull: International Journal of Advanced Manufacturing Technology
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