APA (7th ed.) Citation

Ariff, R., & Sheng, C. K. (2021). Etching characteristics of si wafer thinning in HF/H2O binary solution for microelectronic and nanopackaging applications. Digest Journal of Nanomaterials & Biostructures (DJNB), 16(3), 809. https://doi.org/10.15251/djnb.2021.163.809

Chicago Style (17th ed.) Citation

Ariff, R., and C. K. Sheng. "Etching Characteristics of Si Wafer Thinning in HF/H2O Binary Solution for Microelectronic and Nanopackaging Applications." Digest Journal of Nanomaterials & Biostructures (DJNB) 16, no. 3 (2021): 809. https://doi.org/10.15251/djnb.2021.163.809.

MLA (9th ed.) Citation

Ariff, R., and C. K. Sheng. "Etching Characteristics of Si Wafer Thinning in HF/H2O Binary Solution for Microelectronic and Nanopackaging Applications." Digest Journal of Nanomaterials & Biostructures (DJNB), vol. 16, no. 3, 2021, p. 809, https://doi.org/10.15251/djnb.2021.163.809.