Etching characteristics of si wafer thinning in HF/H2O binary solution for microelectronic and nanopackaging applications.
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| Title: | Etching characteristics of si wafer thinning in HF/H |
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| Authors: | Ariff, R.1,2, Sheng, C. K.1 chankoksheng@umt.edu.my |
| Source: | Digest Journal of Nanomaterials & Biostructures (DJNB). Jul-Sep2021, Vol. 16 Issue 3, p809-814. 6p. |
| Database: | Academic Search Ultimate |
| ISSN: | 18423582 |
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| DOI: | 10.15251/djnb.2021.163.809 |
