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Etching characteristics of si wafer thinning in HF/H2O binary solution for microelectronic and nanopackaging applications.

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Title: Etching characteristics of si wafer thinning in HF/H2O binary solution for microelectronic and nanopackaging applications.
Authors: Ariff, R.1,2, Sheng, C. K.1 chankoksheng@umt.edu.my
Source: Digest Journal of Nanomaterials & Biostructures (DJNB). Jul-Sep2021, Vol. 16 Issue 3, p809-814. 6p.
Database: Academic Search Ultimate
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  Data: Etching characteristics of si wafer thinning in HF/H<subscript>2</subscript>O binary solution for microelectronic and nanopackaging applications.
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  Data: <searchLink fieldCode="JN" term="%22Digest+Journal+of+Nanomaterials+%26+Biostructures+%28DJNB%29%22">Digest Journal of Nanomaterials & Biostructures (DJNB)</searchLink>. Jul-Sep2021, Vol. 16 Issue 3, p809-814. 6p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=152390671
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        Value: 10.15251/djnb.2021.163.809
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      – Code: eng
        Text: English
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      – TitleFull: Etching characteristics of si wafer thinning in HF/H2O binary solution for microelectronic and nanopackaging applications.
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            – D: 01
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              Text: Jul-Sep2021
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              Y: 2021
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