Gao, Q., Jiang, X., Sun, H., Song, T., Mo, D., & Li, X. (2021). Interfacial reaction and microstructure investigation of 4J36/Ni/Cu/V/TC4 diffusion-bonded joints. Materials Letters, 305, N.PAG. https://doi.org/10.1016/j.matlet.2021.130809
Chicago Style (17th ed.) CitationGao, Qi, Xiaosong Jiang, Hongliang Sun, Tingfeng Song, Defeng Mo, and Xue Li. "Interfacial Reaction and Microstructure Investigation of 4J36/Ni/Cu/V/TC4 Diffusion-bonded Joints." Materials Letters 305 (2021): N.PAG. https://doi.org/10.1016/j.matlet.2021.130809.
MLA (9th ed.) CitationGao, Qi, et al. "Interfacial Reaction and Microstructure Investigation of 4J36/Ni/Cu/V/TC4 Diffusion-bonded Joints." Materials Letters, vol. 305, 2021, p. N.PAG, https://doi.org/10.1016/j.matlet.2021.130809.