APA (7th ed.) Citation

Gao, J., Chen, C., Lin, Y., Kuo, C., & Chen, W. (2021). Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory. Macromolecular Materials & Engineering, 306(12), 1. https://doi.org/10.1002/mame.202100512

Chicago Style (17th ed.) Citation

Gao, Jyun‐Yu, Chun‐Kai Chen, Yan‐Cheng Lin, Chi‐Ching Kuo, and Wen‐Chang Chen. "Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory." Macromolecular Materials & Engineering 306, no. 12 (2021): 1. https://doi.org/10.1002/mame.202100512.

MLA (9th ed.) Citation

Gao, Jyun‐Yu, et al. "Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory." Macromolecular Materials & Engineering, vol. 306, no. 12, 2021, p. 1, https://doi.org/10.1002/mame.202100512.