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Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory.

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Title: Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory.
Authors: Gao, Jyun‐Yu1 (AUTHOR), Chen, Chun‐Kai2 (AUTHOR), Lin, Yan‐Cheng2,3 (AUTHOR) ycl2020@ntu.edu.tw, Kuo, Chi‐Ching1 (AUTHOR) kuocc@mail.ntut.edu.tw, Chen, Wen‐Chang2,3 (AUTHOR) chenwc@ntu.edu.tw
Source: Macromolecular Materials & Engineering. Dec2021, Vol. 306 Issue 12, p1-9. 9p.
Database: Academic Search Ultimate
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  Data: <searchLink fieldCode="JN" term="%22Macromolecular+Materials+%26+Engineering%22">Macromolecular Materials & Engineering</searchLink>. Dec2021, Vol. 306 Issue 12, p1-9. 9p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=154220755
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        Value: 10.1002/mame.202100512
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      – Code: eng
        Text: English
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            NameFull: Lin, Yan‐Cheng
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              M: 12
              Text: Dec2021
              Type: published
              Y: 2021
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              Value: 306
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