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Preparation of photo-crosslinkable acrylic copolymer and its debonding property on silicon wafer.

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Title: Preparation of photo-crosslinkable acrylic copolymer and its debonding property on silicon wafer.
Authors: Han, Jinshi1 (AUTHOR), Zhou, Yawei1 (AUTHOR), Bai, Guanghang1 (AUTHOR), Wei, Wei1 (AUTHOR), Liu, Xiaoya1 (AUTHOR), Li, Xiaojie1 (AUTHOR)
Source: Journal of Adhesion Science & Technology. Feb 2022, Vol. 36 Issue 4, p424-436. 13p.
Database: Academic Search Ultimate
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An: 155182552
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PubType: Academic Journal
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  Data: Preparation of photo-crosslinkable acrylic copolymer and its debonding property on silicon wafer.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Adhesion+Science+%26+Technology%22">Journal of Adhesion Science & Technology</searchLink>. Feb 2022, Vol. 36 Issue 4, p424-436. 13p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=155182552
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1080/01694243.2021.1924001
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 13
        StartPage: 424
    Titles:
      – TitleFull: Preparation of photo-crosslinkable acrylic copolymer and its debonding property on silicon wafer.
        Type: main
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          Name:
            NameFull: Han, Jinshi
      – PersonEntity:
          Name:
            NameFull: Zhou, Yawei
      – PersonEntity:
          Name:
            NameFull: Bai, Guanghang
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            NameFull: Wei, Wei
      – PersonEntity:
          Name:
            NameFull: Liu, Xiaoya
      – PersonEntity:
          Name:
            NameFull: Li, Xiaojie
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          Dates:
            – D: 15
              M: 02
              Text: Feb 2022
              Type: published
              Y: 2022
          Identifiers:
            – Type: issn-print
              Value: 01694243
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            – Type: volume
              Value: 36
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Journal of Adhesion Science & Technology
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