THE EFFECT OF POWER ULTRASOUND ON MICROSTRUCTURE EVOLUTION DURING THE TRANSIENT LIQUID STAGE OF ULTRASONIC-PROMOTED TLP BONDING SiCp/Al MMCs. - CHANGZHUANG ZHOU; LIN MA; CHAO ZHU; QINGHE CUI; JINDI LIANG; YUJIAN SONG (Archives of Metallurgy & Materials, 2022)