APA (7th ed.) Citation

Mirone, G., Barbagallo, R., Bua, G., & La Rosa, G. (2023). Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages. Materials (1996-1944), 16(13), 4808. https://doi.org/10.3390/ma16134808

Chicago Style (17th ed.) Citation

Mirone, Giuseppe, Raffaele Barbagallo, Giuseppe Bua, and Guido La Rosa. "Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages." Materials (1996-1944) 16, no. 13 (2023): 4808. https://doi.org/10.3390/ma16134808.

MLA (9th ed.) Citation

Mirone, Giuseppe, et al. "Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages." Materials (1996-1944), vol. 16, no. 13, 2023, p. 4808, https://doi.org/10.3390/ma16134808.