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Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.

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Title: Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.
Authors: Mirone, Giuseppe1 (AUTHOR) gmirone@dii.unict.it, Barbagallo, Raffaele1 (AUTHOR) raffaele.barbagallo@unict.it, Bua, Giuseppe1,2 (AUTHOR) giuseppe.bua@phd.unict.it, La Rosa, Guido1 (AUTHOR) guido.larosa@unict.it
Source: Materials (1996-1944). Jul2023, Vol. 16 Issue 13, p4808. 12p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma16134808