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Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.

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Title: Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.
Authors: Mirone, Giuseppe1 (AUTHOR) gmirone@dii.unict.it, Barbagallo, Raffaele1 (AUTHOR) raffaele.barbagallo@unict.it, Bua, Giuseppe1,2 (AUTHOR) giuseppe.bua@phd.unict.it, La Rosa, Guido1 (AUTHOR) guido.larosa@unict.it
Source: Materials (1996-1944). Jul2023, Vol. 16 Issue 13, p4808. 12p.
Database: Academic Search Ultimate
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An: 164918087
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  Data: Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Jul2023, Vol. 16 Issue 13, p4808. 12p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=164918087
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        Value: 10.3390/ma16134808
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 4808
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      – TitleFull: Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.
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            NameFull: Mirone, Giuseppe
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            NameFull: Barbagallo, Raffaele
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              Text: Jul2023
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              Y: 2023
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              Value: 19961944
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              Value: 16
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              Value: 13
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