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A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints.

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Title: A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints.
Authors: Manoj, Ishan1 (AUTHOR) manoj.ishan@iitkgp.ac.in, Kumar, S.2 (AUTHOR), Jain, Atul1 (AUTHOR)
Source: Journal of Adhesion Science & Technology. Dec2023, Vol. 37 Issue 24, p3652-3686. 35p.
Database: Academic Search Ultimate
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An: 174035146
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PubType: Academic Journal
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  Data: A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints.
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  Data: <searchLink fieldCode="AR" term="%22Manoj%2C+Ishan%22">Manoj, Ishan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> manoj.ishan@iitkgp.ac.in</i><br /><searchLink fieldCode="AR" term="%22Kumar%2C+S%2E%22">Kumar, S.</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jain%2C+Atul%22">Jain, Atul</searchLink><relatesTo>1</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Adhesion+Science+%26+Technology%22">Journal of Adhesion Science & Technology</searchLink>. Dec2023, Vol. 37 Issue 24, p3652-3686. 35p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=174035146
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1080/01694243.2023.2217674
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 35
        StartPage: 3652
    Titles:
      – TitleFull: A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints.
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            NameFull: Manoj, Ishan
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            NameFull: Kumar, S.
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            NameFull: Jain, Atul
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            – D: 15
              M: 12
              Text: Dec2023
              Type: published
              Y: 2023
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              Value: 37
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              Value: 24
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            – TitleFull: Journal of Adhesion Science & Technology
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