A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints.

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Bibliographic Details
Title: A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints.
Authors: Manoj, Ishan1 (AUTHOR) manoj.ishan@iitkgp.ac.in, Kumar, S.2 (AUTHOR), Jain, Atul1 (AUTHOR)
Source: Journal of Adhesion Science & Technology. Dec2023, Vol. 37 Issue 24, p3652-3686. 35p.
Database: Academic Search Ultimate
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ISSN:01694243
DOI:10.1080/01694243.2023.2217674