APA (7th ed.) Citation

Airoldi, A., Alimonti, G., Amati, M., Andreazza, A., Bulgheroni, A., Caccia, M., . . . Vegni, G. (2005). A chip removal facility for indium bump bonded pixel detectors. Nuclear Instruments & Methods in Physics Research Section A, 540(2/3), 259. https://doi.org/10.1016/j.nima.2004.11.042

Chicago Style (17th ed.) Citation

Airoldi, A., et al. "A Chip Removal Facility for Indium Bump Bonded Pixel Detectors." Nuclear Instruments & Methods in Physics Research Section A 540, no. 2/3 (2005): 259. https://doi.org/10.1016/j.nima.2004.11.042.

MLA (9th ed.) Citation

Airoldi, A., et al. "A Chip Removal Facility for Indium Bump Bonded Pixel Detectors." Nuclear Instruments & Methods in Physics Research Section A, vol. 540, no. 2/3, 2005, p. 259, https://doi.org/10.1016/j.nima.2004.11.042.