A chip removal facility for indium bump bonded pixel detectors
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| Title: | A chip removal facility for indium bump bonded pixel detectors |
|---|---|
| Authors: | Airoldi, A.1, Alimonti, G.2 Gianluca.Alimonti@mi.infn.it, Amati, M.1, Andreazza, A.2, Bulgheroni, A.1, Caccia, M.1, Giugni, D.2, Kucewicz, W.3, Lari, T.2, Meroni, C.2, Ragusa, F.2, Troncon, C.2, Vegni, G.2 |
| Source: | Nuclear Instruments & Methods in Physics Research Section A. Mar2005, Vol. 540 Issue 2/3, p259-265. 7p. |
| Database: | Academic Search Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 17514389 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=17514389 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.nima.2004.11.042 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 7 StartPage: 259 Titles: – TitleFull: A chip removal facility for indium bump bonded pixel detectors Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Airoldi, A. – PersonEntity: Name: NameFull: Alimonti, G. – PersonEntity: Name: NameFull: Amati, M. – PersonEntity: Name: NameFull: Andreazza, A. – PersonEntity: Name: NameFull: Bulgheroni, A. – PersonEntity: Name: NameFull: Caccia, M. – PersonEntity: Name: NameFull: Giugni, D. – PersonEntity: Name: NameFull: Kucewicz, W. – PersonEntity: Name: NameFull: Lari, T. – PersonEntity: Name: NameFull: Meroni, C. – PersonEntity: Name: NameFull: Ragusa, F. – PersonEntity: Name: NameFull: Troncon, C. – PersonEntity: Name: NameFull: Vegni, G. IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 03 Text: Mar2005 Type: published Y: 2005 Identifiers: – Type: issn-print Value: 01689002 Numbering: – Type: volume Value: 540 – Type: issue Value: 2/3 Titles: – TitleFull: Nuclear Instruments & Methods in Physics Research Section A Type: main |
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