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A chip removal facility for indium bump bonded pixel detectors

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Bibliographic Details
Title: A chip removal facility for indium bump bonded pixel detectors
Authors: Airoldi, A.1, Alimonti, G.2 Gianluca.Alimonti@mi.infn.it, Amati, M.1, Andreazza, A.2, Bulgheroni, A.1, Caccia, M.1, Giugni, D.2, Kucewicz, W.3, Lari, T.2, Meroni, C.2, Ragusa, F.2, Troncon, C.2, Vegni, G.2
Source: Nuclear Instruments & Methods in Physics Research Section A. Mar2005, Vol. 540 Issue 2/3, p259-265. 7p.
Database: Academic Search Ultimate
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