Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.

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Bibliographic Details
Title:	Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.
Authors:	Pingping Ye¹ pingping.ye@macdermidalpha.com, Jianwen Han¹, Braye, Stephan¹, Whitten, Kyle¹, Hayes, Veronica¹, Khanna, Harshul¹, Letize, Adam¹, Richardson, Thomas¹, Najjar, Elie¹
Source:	Journal of Microelectronic & Electronic Packaging. 2024, Vol. 21 Issue 1, p20-24. 5p.
Database:	Academic Search Ultimate

Description
ISSN:	15514897
DOI:	10.4071/001c.115497