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Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.

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Title: Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.
Authors: Pingping Ye1 pingping.ye@macdermidalpha.com, Jianwen Han1, Braye, Stephan1, Whitten, Kyle1, Hayes, Veronica1, Khanna, Harshul1, Letize, Adam1, Richardson, Thomas1, Najjar, Elie1
Source: Journal of Microelectronic & Electronic Packaging. 2024, Vol. 21 Issue 1, p20-24. 5p.
Database: Academic Search Ultimate
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  Data: Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2024, Vol. 21 Issue 1, p20-24. 5p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=176526434
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        Value: 10.4071/001c.115497
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        Text: English
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        PageCount: 5
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      – TitleFull: Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.
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              Text: 2024
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