APA (7th ed.) Citation

Yi, J., Pei, K., Li, Z., Zhou, W., & Deng, H. (2024). Numerical and experimental investigation on temperature field during small-module gear creep feed deep profile grinding. International Journal of Advanced Manufacturing Technology, 132(9/10), 4965. https://doi.org/10.1007/s00170-024-13655-z

Chicago Style (17th ed.) Citation

Yi, Jun, Kanglin Pei, Zhihong Li, Wei Zhou, and Hui Deng. "Numerical and Experimental Investigation on Temperature Field During Small-module Gear Creep Feed Deep Profile Grinding." International Journal of Advanced Manufacturing Technology 132, no. 9/10 (2024): 4965. https://doi.org/10.1007/s00170-024-13655-z.

MLA (9th ed.) Citation

Yi, Jun, et al. "Numerical and Experimental Investigation on Temperature Field During Small-module Gear Creep Feed Deep Profile Grinding." International Journal of Advanced Manufacturing Technology, vol. 132, no. 9/10, 2024, p. 4965, https://doi.org/10.1007/s00170-024-13655-z.