Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
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| Title: | Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH |
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| Authors: | Tang, Liangliang1,2 (AUTHOR), Yao, Dongxu1 (AUTHOR), Xia, Yongfeng1 (AUTHOR), Zhao, Jun1 (AUTHOR), Zhu, Ming1 (AUTHOR), Zeng, Yu‐Ping1 (AUTHOR) yuping-zeng@mail.sic.ac.cn |
| Source: | Journal of the American Ceramic Society. Sep2024, Vol. 107 Issue 9, p6439-6455. 17p. |
| Database: | Academic Search Ultimate |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 178178790 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH<subscript>2</subscript> filler. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Tang%2C+Liangliang%22">Tang, Liangliang</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yao%2C+Dongxu%22">Yao, Dongxu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xia%2C+Yongfeng%22">Xia, Yongfeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhao%2C+Jun%22">Zhao, Jun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhu%2C+Ming%22">Zhu, Ming</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zeng%2C+Yu‐Ping%22">Zeng, Yu‐Ping</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yuping-zeng@mail.sic.ac.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+the+American+Ceramic+Society%22">Journal of the American Ceramic Society</searchLink>. Sep2024, Vol. 107 Issue 9, p6439-6455. 17p. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=178178790 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1111/jace.19921 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 17 StartPage: 6439 Titles: – TitleFull: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Tang, Liangliang – PersonEntity: Name: NameFull: Yao, Dongxu – PersonEntity: Name: NameFull: Xia, Yongfeng – PersonEntity: Name: NameFull: Zhao, Jun – PersonEntity: Name: NameFull: Zhu, Ming – PersonEntity: Name: NameFull: Zeng, Yu‐Ping IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 09 Text: Sep2024 Type: published Y: 2024 Identifiers: – Type: issn-print Value: 00027820 Numbering: – Type: volume Value: 107 – Type: issue Value: 9 Titles: – TitleFull: Journal of the American Ceramic Society Type: main |
| ResultId | 1 |