APA (7th ed.) Citation

Hung, H., Cheng, Y., Hwang, S., Chen, D., Chang, H., Huang, B., . . . Hung, C. (2024). Analysis of flip-chip ball grid array underfill flow process. International Journal of Advanced Manufacturing Technology, 134(9/10), 4851. https://doi.org/10.1007/s00170-024-14304-1

Chicago Style (17th ed.) Citation

Hung, Hao-Hsi, Yu-Chi Cheng, Sheng-Jye Hwang, Dao-Long Chen, Hui-Jing Chang, Bing-Yuan Huang, Hung-Hsien Huang, Chen-Chao Wang, and Chih-Pin Hung. "Analysis of Flip-chip Ball Grid Array Underfill Flow Process." International Journal of Advanced Manufacturing Technology 134, no. 9/10 (2024): 4851. https://doi.org/10.1007/s00170-024-14304-1.

MLA (9th ed.) Citation

Hung, Hao-Hsi, et al. "Analysis of Flip-chip Ball Grid Array Underfill Flow Process." International Journal of Advanced Manufacturing Technology, vol. 134, no. 9/10, 2024, p. 4851, https://doi.org/10.1007/s00170-024-14304-1.