Analysis of flip-chip ball grid array underfill flow process.
Saved in:
| Title: | Analysis of flip-chip ball grid array underfill flow process. |
|---|---|
| Authors: | Hung, Hao-Hsi1 (AUTHOR), Cheng, Yu-Chi1 (AUTHOR), Hwang, Sheng-Jye1 (AUTHOR) jimppl@mail.ncku.edu.tw, Chen, Dao-Long2 (AUTHOR), Chang, Hui-Jing2 (AUTHOR), Huang, Bing-Yuan2 (AUTHOR), Huang, Hung-Hsien2 (AUTHOR), Wang, Chen-Chao2 (AUTHOR), Hung, Chih-Pin2 (AUTHOR) |
| Source: | International Journal of Advanced Manufacturing Technology. Oct2024, Vol. 134 Issue 9/10, p4851-4870. 20p. |
| Database: | Academic Search Ultimate |
|
Full text is not displayed to guests.
Login for full access.
|
|
| FullText | Links: – Type: pdflink Text: Availability: 1 |
|---|---|
| Header | DbId: asn DbLabel: Academic Search Ultimate An: 179873622 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Analysis of flip-chip ball grid array underfill flow process. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Hung%2C+Hao-Hsi%22">Hung, Hao-Hsi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Cheng%2C+Yu-Chi%22">Cheng, Yu-Chi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hwang%2C+Sheng-Jye%22">Hwang, Sheng-Jye</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jimppl@mail.ncku.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Dao-Long%22">Chen, Dao-Long</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chang%2C+Hui-Jing%22">Chang, Hui-Jing</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Huang%2C+Bing-Yuan%22">Huang, Bing-Yuan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Huang%2C+Hung-Hsien%22">Huang, Hung-Hsien</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Chen-Chao%22">Wang, Chen-Chao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hung%2C+Chih-Pin%22">Hung, Chih-Pin</searchLink><relatesTo>2</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Oct2024, Vol. 134 Issue 9/10, p4851-4870. 20p. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=179873622 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s00170-024-14304-1 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 20 StartPage: 4851 Titles: – TitleFull: Analysis of flip-chip ball grid array underfill flow process. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hung, Hao-Hsi – PersonEntity: Name: NameFull: Cheng, Yu-Chi – PersonEntity: Name: NameFull: Hwang, Sheng-Jye – PersonEntity: Name: NameFull: Chen, Dao-Long – PersonEntity: Name: NameFull: Chang, Hui-Jing – PersonEntity: Name: NameFull: Huang, Bing-Yuan – PersonEntity: Name: NameFull: Huang, Hung-Hsien – PersonEntity: Name: NameFull: Wang, Chen-Chao – PersonEntity: Name: NameFull: Hung, Chih-Pin IsPartOfRelationships: – BibEntity: Dates: – D: 15 M: 10 Text: Oct2024 Type: published Y: 2024 Identifiers: – Type: issn-print Value: 02683768 Numbering: – Type: volume Value: 134 – Type: issue Value: 9/10 Titles: – TitleFull: International Journal of Advanced Manufacturing Technology Type: main |
| ResultId | 1 |