Analysis of flip-chip ball grid array underfill flow process.

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Title: Analysis of flip-chip ball grid array underfill flow process.
Authors: Hung, Hao-Hsi1 (AUTHOR), Cheng, Yu-Chi1 (AUTHOR), Hwang, Sheng-Jye1 (AUTHOR) jimppl@mail.ncku.edu.tw, Chen, Dao-Long2 (AUTHOR), Chang, Hui-Jing2 (AUTHOR), Huang, Bing-Yuan2 (AUTHOR), Huang, Hung-Hsien2 (AUTHOR), Wang, Chen-Chao2 (AUTHOR), Hung, Chih-Pin2 (AUTHOR)
Source: International Journal of Advanced Manufacturing Technology. Oct2024, Vol. 134 Issue 9/10, p4851-4870. 20p.
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  Data: Analysis of flip-chip ball grid array underfill flow process.
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  Data: <searchLink fieldCode="AR" term="%22Hung%2C+Hao-Hsi%22">Hung, Hao-Hsi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Cheng%2C+Yu-Chi%22">Cheng, Yu-Chi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hwang%2C+Sheng-Jye%22">Hwang, Sheng-Jye</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jimppl@mail.ncku.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Dao-Long%22">Chen, Dao-Long</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chang%2C+Hui-Jing%22">Chang, Hui-Jing</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Huang%2C+Bing-Yuan%22">Huang, Bing-Yuan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Huang%2C+Hung-Hsien%22">Huang, Hung-Hsien</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Chen-Chao%22">Wang, Chen-Chao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hung%2C+Chih-Pin%22">Hung, Chih-Pin</searchLink><relatesTo>2</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Oct2024, Vol. 134 Issue 9/10, p4851-4870. 20p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=179873622
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        Value: 10.1007/s00170-024-14304-1
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              Text: Oct2024
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