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Analysis of flip-chip ball grid array underfill flow process.

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Bibliographic Details
Title: Analysis of flip-chip ball grid array underfill flow process.
Authors: Hung, Hao-Hsi1 (AUTHOR), Cheng, Yu-Chi1 (AUTHOR), Hwang, Sheng-Jye1 (AUTHOR) jimppl@mail.ncku.edu.tw, Chen, Dao-Long2 (AUTHOR), Chang, Hui-Jing2 (AUTHOR), Huang, Bing-Yuan2 (AUTHOR), Huang, Hung-Hsien2 (AUTHOR), Wang, Chen-Chao2 (AUTHOR), Hung, Chih-Pin2 (AUTHOR)
Source: International Journal of Advanced Manufacturing Technology. Oct2024, Vol. 134 Issue 9/10, p4851-4870. 20p.
Database: Academic Search Ultimate
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Description
ISSN:02683768
DOI:10.1007/s00170-024-14304-1