APA (7th ed.) Citation

Shim, C., Lee, S., Kong, M., Kim, I., Kwak, J., Jang, W., . . . Jeong, U. (2024). Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board. Advanced Science, 11(40), 1. https://doi.org/10.1002/advs.202403587

Chicago Style (17th ed.) Citation

Shim, Chae‐Eun, et al. "Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board." Advanced Science 11, no. 40 (2024): 1. https://doi.org/10.1002/advs.202403587.

MLA (9th ed.) Citation

Shim, Chae‐Eun, et al. "Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board." Advanced Science, vol. 11, no. 40, 2024, p. 1, https://doi.org/10.1002/advs.202403587.