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Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board.

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Title: Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board.
Authors: Shim, Chae‐Eun1 (AUTHOR), Lee, Sangseob2 (AUTHOR), Kong, Minsik1 (AUTHOR), Kim, Ik‐Soo1 (AUTHOR), Kwak, Jaeik1 (AUTHOR), Jang, Woosun3 (AUTHOR), Jeong, Se‐Young4 (AUTHOR), Kim, Dong Wook5 (AUTHOR) dongwkim@is.mpg.de, Soon, Aloysius2 (AUTHOR) aloysius.soon@yonsei.ac.kr, Jeong, Unyong1 (AUTHOR) ujeong@postech.ac.kr
Source: Advanced Science. 10/28/2024, Vol. 11 Issue 40, p1-13. 13p.
Database: Academic Search Ultimate
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Description
ISSN:21983844
DOI:10.1002/advs.202403587