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Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board.

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Title: Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board.
Authors: Shim, Chae‐Eun1 (AUTHOR), Lee, Sangseob2 (AUTHOR), Kong, Minsik1 (AUTHOR), Kim, Ik‐Soo1 (AUTHOR), Kwak, Jaeik1 (AUTHOR), Jang, Woosun3 (AUTHOR), Jeong, Se‐Young4 (AUTHOR), Kim, Dong Wook5 (AUTHOR) dongwkim@is.mpg.de, Soon, Aloysius2 (AUTHOR) aloysius.soon@yonsei.ac.kr, Jeong, Unyong1 (AUTHOR) ujeong@postech.ac.kr
Source: Advanced Science. 10/28/2024, Vol. 11 Issue 40, p1-13. 13p.
Database: Academic Search Ultimate
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An: 180520475
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  Data: Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board.
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  Data: <searchLink fieldCode="AR" term="%22Shim%2C+Chae‐Eun%22">Shim, Chae‐Eun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lee%2C+Sangseob%22">Lee, Sangseob</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kong%2C+Minsik%22">Kong, Minsik</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Ik‐Soo%22">Kim, Ik‐Soo</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kwak%2C+Jaeik%22">Kwak, Jaeik</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jang%2C+Woosun%22">Jang, Woosun</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jeong%2C+Se‐Young%22">Jeong, Se‐Young</searchLink><relatesTo>4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Dong+Wook%22">Kim, Dong Wook</searchLink><relatesTo>5</relatesTo> (AUTHOR)<i> dongwkim@is.mpg.de</i><br /><searchLink fieldCode="AR" term="%22Soon%2C+Aloysius%22">Soon, Aloysius</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> aloysius.soon@yonsei.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Jeong%2C+Unyong%22">Jeong, Unyong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ujeong@postech.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Science%22">Advanced Science</searchLink>. 10/28/2024, Vol. 11 Issue 40, p1-13. 13p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=180520475
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        Value: 10.1002/advs.202403587
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        Text: English
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      – TitleFull: Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board.
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              Text: 10/28/2024
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              Y: 2024
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