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Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination.

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Title: Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination.
Authors: Lu, Fuye1 (AUTHOR) fuyel@mail.dlut.edu.cn, Sun, Han1 (AUTHOR) 12405053@mail.dlut.edu.cn, Yang, Wenlong1 (AUTHOR) ywl@mail.dlut.edu.cn, Zhou, Tianshuo1 (AUTHOR) zhou22205039@mail.dlut.edu.cn, Wang, Yunpeng1 (AUTHOR) yunpengw@dlut.edu.cn, Ma, Haoran2 (AUTHOR) mhr@dlut.edu.cn, Ma, Haitao1 (AUTHOR) htma@dlut.edu.cn, Chen, Jun2 (AUTHOR) htma@dlut.edu.cn
Source: Materials (1996-1944). Nov2024, Vol. 17 Issue 21, p5172. 11p.
Database: Academic Search Ultimate
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ISSN:19961944
DOI:10.3390/ma17215172