Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination.
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| Title: | Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination. |
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| Authors: | Lu, Fuye1 (AUTHOR) fuyel@mail.dlut.edu.cn, Sun, Han1 (AUTHOR) 12405053@mail.dlut.edu.cn, Yang, Wenlong1 (AUTHOR) ywl@mail.dlut.edu.cn, Zhou, Tianshuo1 (AUTHOR) zhou22205039@mail.dlut.edu.cn, Wang, Yunpeng1 (AUTHOR) yunpengw@dlut.edu.cn, Ma, Haoran2 (AUTHOR) mhr@dlut.edu.cn, Ma, Haitao1 (AUTHOR) htma@dlut.edu.cn, Chen, Jun2 (AUTHOR) htma@dlut.edu.cn |
| Source: | Materials (1996-1944). Nov2024, Vol. 17 Issue 21, p5172. 11p. |
| Database: | Academic Search Ultimate |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 180781301 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Lu%2C+Fuye%22">Lu, Fuye</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> fuyel@mail.dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Sun%2C+Han%22">Sun, Han</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 12405053@mail.dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Yang%2C+Wenlong%22">Yang, Wenlong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ywl@mail.dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Zhou%2C+Tianshuo%22">Zhou, Tianshuo</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> zhou22205039@mail.dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Yunpeng%22">Wang, Yunpeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yunpengw@dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Ma%2C+Haoran%22">Ma, Haoran</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> mhr@dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Ma%2C+Haitao%22">Ma, Haitao</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> htma@dlut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Jun%22">Chen, Jun</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> htma@dlut.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Nov2024, Vol. 17 Issue 21, p5172. 11p. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=180781301 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/ma17215172 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 5172 Titles: – TitleFull: Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lu, Fuye – PersonEntity: Name: NameFull: Sun, Han – PersonEntity: Name: NameFull: Yang, Wenlong – PersonEntity: Name: NameFull: Zhou, Tianshuo – PersonEntity: Name: NameFull: Wang, Yunpeng – PersonEntity: Name: NameFull: Ma, Haoran – PersonEntity: Name: NameFull: Ma, Haitao – PersonEntity: Name: NameFull: Chen, Jun IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 11 Text: Nov2024 Type: published Y: 2024 Identifiers: – Type: issn-print Value: 19961944 Numbering: – Type: volume Value: 17 – Type: issue Value: 21 Titles: – TitleFull: Materials (1996-1944) Type: main |
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