Choi, S., Oh, J., Sim, B., & Lee, W. (2025). Active compliance control of grinding process for stripping enameled copper wire. International Journal of Advanced Manufacturing Technology, 136(3), 1671. https://doi.org/10.1007/s00170-024-14940-7
Chicago Style (17th ed.) CitationChoi, Sung-Jin, Jun-young Oh, Beomsik Sim, and Wonkyun Lee. "Active Compliance Control of Grinding Process for Stripping Enameled Copper Wire." International Journal of Advanced Manufacturing Technology 136, no. 3 (2025): 1671. https://doi.org/10.1007/s00170-024-14940-7.
MLA (9th ed.) CitationChoi, Sung-Jin, et al. "Active Compliance Control of Grinding Process for Stripping Enameled Copper Wire." International Journal of Advanced Manufacturing Technology, vol. 136, no. 3, 2025, p. 1671, https://doi.org/10.1007/s00170-024-14940-7.