Yan, L., Liu, Z., Wang, J., & Yu, L. (2025). Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering. Nano-Micro Letters, 17(1), 1. https://doi.org/10.1007/s40820-025-01724-1
Chicago Style (17th ed.) CitationYan, Lei, Zongguang Liu, Junzhuan Wang, and Linwei Yu. "Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering." Nano-Micro Letters 17, no. 1 (2025): 1. https://doi.org/10.1007/s40820-025-01724-1.
MLA (9th ed.) CitationYan, Lei, et al. "Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering." Nano-Micro Letters, vol. 17, no. 1, 2025, p. 1, https://doi.org/10.1007/s40820-025-01724-1.
Warning: These citations may not always be 100% accurate.