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Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering.

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Title: Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering.
Authors: Yan, Lei1 (AUTHOR), Liu, Zongguang2 (AUTHOR) zgliu@yzu.edu.cn, Wang, Junzhuan1 (AUTHOR) wangjz@nju.edu.cn, Yu, Linwei1 (AUTHOR) yulinwei@nju.edu.cn
Source: Nano-Micro Letters. 4/14/2025, Vol. 17 Issue 1, p1-47. 47p.
Database: Academic Search Ultimate
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  Data: Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering.
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  Data: <searchLink fieldCode="JN" term="%22Nano-Micro+Letters%22">Nano-Micro Letters</searchLink>. 4/14/2025, Vol. 17 Issue 1, p1-47. 47p.
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        Value: 10.1007/s40820-025-01724-1
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        Text: English
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              Text: 4/14/2025
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