Wang, C., & Lin, C. (2025). Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys. Materials (1996-1944), 18(12), 2680. https://doi.org/10.3390/ma18122680
Chicago Style (17th ed.) CitationWang, Chao-Hong, and Che-Yang Lin. "Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys." Materials (1996-1944) 18, no. 12 (2025): 2680. https://doi.org/10.3390/ma18122680.
MLA (9th ed.) CitationWang, Chao-Hong, and Che-Yang Lin. "Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys." Materials (1996-1944), vol. 18, no. 12, 2025, p. 2680, https://doi.org/10.3390/ma18122680.
Warning: These citations may not always be 100% accurate.