First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd3, Cu3Pd, and Cu4Pd.
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| Title: | First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd |
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| Authors: | Cheng, Hsien-Chie1 (AUTHOR), Yu, Ching-Feng2 (AUTHOR) cfyu@nuu.edu.tw |
| Source: | New Journal of Chemistry. 8/21/2025, Vol. 49 Issue 31, p13607-13629. 23p. |
| Database: | Academic Search Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 187143918 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd<subscript>3</subscript>, Cu<subscript>3</subscript>Pd, and Cu<subscript>4</subscript>Pd. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Cheng%2C+Hsien-Chie%22">Cheng, Hsien-Chie</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yu%2C+Ching-Feng%22">Yu, Ching-Feng</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> cfyu@nuu.edu.tw</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22New+Journal+of+Chemistry%22">New Journal of Chemistry</searchLink>. 8/21/2025, Vol. 49 Issue 31, p13607-13629. 23p. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=187143918 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1039/d5nj02120k Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 23 StartPage: 13607 Titles: – TitleFull: First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd3, Cu3Pd, and Cu4Pd. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Cheng, Hsien-Chie – PersonEntity: Name: NameFull: Yu, Ching-Feng IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 08 Text: 8/21/2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 11440546 Numbering: – Type: volume Value: 49 – Type: issue Value: 31 Titles: – TitleFull: New Journal of Chemistry Type: main |
| ResultId | 1 |