View in EDS HTML Full Text PDF Full Text

Minimizing Intersheet Junction Resistivity via Au4Cu2 Nanocluster‐Based Connectivity in Mo2TiC2 MXene for Symmetric Supercapacitor Device.

Saved in:
Bibliographic Details
Title: Minimizing Intersheet Junction Resistivity via Au4Cu2 Nanocluster‐Based Connectivity in Mo2TiC2 MXene for Symmetric Supercapacitor Device.
Authors: Nawaz, Tehseen1,2 (AUTHOR), Ahmad, Muhammad3,4,5 (AUTHOR) mahmadrt90@gmail.com, Hussain, Iftikhar3 (AUTHOR), Chen, Xi3 (AUTHOR), Abraham, B. Moses4,6 (AUTHOR), Zhuang, Shengli1 (AUTHOR), Low, Kam Hung1 (AUTHOR), Zhang, Kaili3 (AUTHOR) kaizhang@cityu.edu.hk, He, Jian1,7 (AUTHOR) jianhe@hku.hk
Source: Small Structures. Aug2025, Vol. 6 Issue 8, p1-11. 11p.
Database: Academic Search Ultimate
Full text is not displayed to guests.
Description
ISSN:26884062
DOI:10.1002/sstr.202400664