Ma, X., Xia, Y., Song, M., Chen, W., & Yan, J. (2025). Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys. International Journal of Applied Ceramic Technology, 22(6), 1. https://doi.org/10.1111/ijac.70015
Chicago Style (17th ed.) CitationMa, Xinran, Yuanhang Xia, Mingda Song, Wei Chen, and Jiuchun Yan. "Role of Active Element Al in the Interfacial Bonding of Sapphire by Ultrasonic‐assisted Soldering Using Sn‐based Alloys." International Journal of Applied Ceramic Technology 22, no. 6 (2025): 1. https://doi.org/10.1111/ijac.70015.
MLA (9th ed.) CitationMa, Xinran, et al. "Role of Active Element Al in the Interfacial Bonding of Sapphire by Ultrasonic‐assisted Soldering Using Sn‐based Alloys." International Journal of Applied Ceramic Technology, vol. 22, no. 6, 2025, p. 1, https://doi.org/10.1111/ijac.70015.