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Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys.

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Title: Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys.
Authors: Ma, Xinran1 (AUTHOR), Xia, Yuanhang1,2 (AUTHOR), Song, Mingda1 (AUTHOR), Chen, Wei1 (AUTHOR), Yan, Jiuchun1 (AUTHOR) jcyan@hit.edu.cn
Source: International Journal of Applied Ceramic Technology. Nov/Dec2025, Vol. 22 Issue 6, p1-13. 13p.
Database: Academic Search Ultimate
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  Data: Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys.
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  Data: <searchLink fieldCode="AR" term="%22Ma%2C+Xinran%22">Ma, Xinran</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xia%2C+Yuanhang%22">Xia, Yuanhang</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Song%2C+Mingda%22">Song, Mingda</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Wei%22">Chen, Wei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yan%2C+Jiuchun%22">Yan, Jiuchun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jcyan@hit.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Applied+Ceramic+Technology%22">International Journal of Applied Ceramic Technology</searchLink>. Nov/Dec2025, Vol. 22 Issue 6, p1-13. 13p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=188425960
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        Value: 10.1111/ijac.70015
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      – Code: eng
        Text: English
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      – TitleFull: Role of active element Al in the interfacial bonding of sapphire by ultrasonic‐assisted soldering using Sn‐based alloys.
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            NameFull: Ma, Xinran
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            NameFull: Xia, Yuanhang
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            NameFull: Song, Mingda
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            NameFull: Chen, Wei
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              M: 11
              Text: Nov/Dec2025
              Type: published
              Y: 2025
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