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Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding.

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Bibliographic Details
Title: Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding.
Authors: Park, Sang Woo1 (AUTHOR), Han, Hee2 (AUTHOR), Ahn, Chi Won2 (AUTHOR), Park, Jong Kyung1 (AUTHOR) jkpark1@seoultech.ac.kr
Source: Scientific Reports. 10/21/2025, Vol. 15 Issue 1, p1-10. 10p.
Database: Academic Search Ultimate
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ISSN:20452322
DOI:10.1038/s41598-025-20296-z