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Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding.

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Title: Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding.
Authors: Park, Sang Woo1 (AUTHOR), Han, Hee2 (AUTHOR), Ahn, Chi Won2 (AUTHOR), Park, Jong Kyung1 (AUTHOR) jkpark1@seoultech.ac.kr
Source: Scientific Reports. 10/21/2025, Vol. 15 Issue 1, p1-10. 10p.
Database: Academic Search Ultimate
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  Data: Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding.
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  Data: <searchLink fieldCode="AR" term="%22Park%2C+Sang+Woo%22">Park, Sang Woo</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Han%2C+Hee%22">Han, Hee</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ahn%2C+Chi+Won%22">Ahn, Chi Won</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Park%2C+Jong+Kyung%22">Park, Jong Kyung</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jkpark1@seoultech.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Scientific+Reports%22">Scientific Reports</searchLink>. 10/21/2025, Vol. 15 Issue 1, p1-10. 10p.
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        Value: 10.1038/s41598-025-20296-z
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        Text: English
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            NameFull: Han, Hee
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              Text: 10/21/2025
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