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Modeling of Residual Stress, Plastic Deformation, and Permanent Warpage Induced by the Resin Molding Process in SiC-Based Power Modules.

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Title: Modeling of Residual Stress, Plastic Deformation, and Permanent Warpage Induced by the Resin Molding Process in SiC-Based Power Modules.
Authors: Mirone, Giuseppe1 (AUTHOR) giuseppe.mirone@unict.it, Corallo, Luca1,2 (AUTHOR), Barbagallo, Raffaele1 (AUTHOR), Bua, Giuseppe1,2 (AUTHOR)
Source: Energies (19961073). Oct2025, Vol. 18 Issue 20, p5364. 22p.
Database: Academic Search Ultimate
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        Value: 10.3390/en18205364
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              Text: Oct2025
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