Cui, C., Sartory, B., Tkadletz, M., Burtscher, M., Kiener, D., Reisinger, M., . . . Brunner, R. (2025). Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling. Scientific Reports, 15(1), 1. https://doi.org/10.1038/s41598-025-25169-z
Chicago Style (17th ed.) CitationCui, Charlotte, Bernhard Sartory, Michael Tkadletz, Michael Burtscher, Daniel Kiener, Michael Reisinger, Peter Imrich, Walter Hartner, and Roland Brunner. "Sample Preparation Induced Artefacts in Soft SAC Solders from Uncooled and Cooled Argon Ion Milling." Scientific Reports 15, no. 1 (2025): 1. https://doi.org/10.1038/s41598-025-25169-z.
MLA (9th ed.) CitationCui, Charlotte, et al. "Sample Preparation Induced Artefacts in Soft SAC Solders from Uncooled and Cooled Argon Ion Milling." Scientific Reports, vol. 15, no. 1, 2025, p. 1, https://doi.org/10.1038/s41598-025-25169-z.