Cietek, D., & Hebert, R. J. (2025). Ag–Cu solid–liquid interface velocity and growth morphology dependence on material data variations under rapid solidification conditions. Philosophical Magazine Letters, 105(1), 1. https://doi.org/10.1080/09500839.2024.2447328
Chicago Style (17th ed.) CitationCietek, D., and R. J. Hebert. "Ag–Cu Solid–liquid Interface Velocity and Growth Morphology Dependence on Material Data Variations Under Rapid Solidification Conditions." Philosophical Magazine Letters 105, no. 1 (2025): 1. https://doi.org/10.1080/09500839.2024.2447328.
MLA (9th ed.) CitationCietek, D., and R. J. Hebert. "Ag–Cu Solid–liquid Interface Velocity and Growth Morphology Dependence on Material Data Variations Under Rapid Solidification Conditions." Philosophical Magazine Letters, vol. 105, no. 1, 2025, p. 1, https://doi.org/10.1080/09500839.2024.2447328.