APA (7th ed.) Citation

ABDUL AZIZ, M. S., KHOR, C. Y., SABRI, M. R. M., KAMARUDIN, R., RAHIMAN, W., CHE HALIN, D. S., & PIETRUSIEWICZ, P. (2025). INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING. Archives of Metallurgy & Materials, 70(4), 1777. https://doi.org/10.24425/amm.2025.156261

Chicago Style (17th ed.) Citation

ABDUL AZIZ, M. S., C. Y. KHOR, M. R. M. SABRI, R. KAMARUDIN, W. RAHIMAN, D. S. CHE HALIN, and P. PIETRUSIEWICZ. "INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING." Archives of Metallurgy & Materials 70, no. 4 (2025): 1777. https://doi.org/10.24425/amm.2025.156261.

MLA (9th ed.) Citation

ABDUL AZIZ, M. S., et al. "INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING." Archives of Metallurgy & Materials, vol. 70, no. 4, 2025, p. 1777, https://doi.org/10.24425/amm.2025.156261.