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INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING.

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Title: INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING.
Authors: ABDUL AZIZ, M. S.1, KHOR, C. Y.2 cykhor@unimap.edu.my, SABRI, M. R. M.1, KAMARUDIN, R.1, RAHIMAN, W.3, CHE HALIN, D. S.4,5, PIETRUSIEWICZ, P.6
Source: Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1777-1783. 7p.
Database: Academic Search Ultimate
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An: 190364970
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PubType: Academic Journal
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  Data: <searchLink fieldCode="JN" term="%22Archives+of+Metallurgy+%26+Materials%22">Archives of Metallurgy & Materials</searchLink>. 2025, Vol. 70 Issue 4, p1777-1783. 7p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=190364970
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        Value: 10.24425/amm.2025.156261
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      – Code: eng
        Text: English
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      – TitleFull: INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING.
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              Text: 2025
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