INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING.
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| Title: | INFLUENCE OF TEMPERATURE ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING. |
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| Authors: | ABDUL AZIZ, M. S.1, KHOR, C. Y.2 cykhor@unimap.edu.my, SABRI, M. R. M.1, KAMARUDIN, R.1, RAHIMAN, W.3, CHE HALIN, D. S.4,5, PIETRUSIEWICZ, P.6 |
| Source: | Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1777-1783. 7p. |
| Database: | Academic Search Ultimate |
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