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Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.

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Title: Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.
Authors: Meshki Zadeh, Pouria1 (AUTHOR), Brand, Sebastian2 (AUTHOR), Dehghan-Niri, Ehsan1 (AUTHOR) nde@asu.edu
Source: Sensors (14248220). Dec2025, Vol. 25 Issue 24, p7499. 36p.
Database: Academic Search Ultimate
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  Data: Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.
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  Data: <searchLink fieldCode="JN" term="%22Sensors+%2814248220%29%22">Sensors (14248220)</searchLink>. Dec2025, Vol. 25 Issue 24, p7499. 36p.
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        Value: 10.3390/s25247499
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        Text: English
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      – TitleFull: Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.
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              Text: Dec2025
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