APA (7th ed.) Citation

Virmani, D., & Chatterjee, B. (2025). Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design. Eng (2673-4117), 6(12), 373. https://doi.org/10.3390/eng6120373

Chicago Style (17th ed.) Citation

Virmani, Darpan, and Baibhab Chatterjee. "Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design." Eng (2673-4117) 6, no. 12 (2025): 373. https://doi.org/10.3390/eng6120373.

MLA (9th ed.) Citation

Virmani, Darpan, and Baibhab Chatterjee. "Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design." Eng (2673-4117), vol. 6, no. 12, 2025, p. 373, https://doi.org/10.3390/eng6120373.