APA (7th ed.) Citation

Huang, C., & Su, H. (2026). Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards. Mathematics (2227-7390), 14(2), 327. https://doi.org/10.3390/math14020327

Chicago Style (17th ed.) Citation

Huang, Cheng-Hung, and Hao-Wei Su. "Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards." Mathematics (2227-7390) 14, no. 2 (2026): 327. https://doi.org/10.3390/math14020327.

MLA (9th ed.) Citation

Huang, Cheng-Hung, and Hao-Wei Su. "Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards." Mathematics (2227-7390), vol. 14, no. 2, 2026, p. 327, https://doi.org/10.3390/math14020327.