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Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.

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Title: Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.
Authors: Huang, Cheng-Hung1 (AUTHOR) chhuang@maul.ncku.edu.tw, Su, Hao-Wei1 (AUTHOR)
Source: Mathematics (2227-7390). Jan2026, Vol. 14 Issue 2, p327. 27p.
Database: Academic Search Ultimate
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  Data: Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.
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  Data: <searchLink fieldCode="AR" term="%22Huang%2C+Cheng-Hung%22">Huang, Cheng-Hung</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> chhuang@maul.ncku.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Su%2C+Hao-Wei%22">Su, Hao-Wei</searchLink><relatesTo>1</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Mathematics+%282227-7390%29%22">Mathematics (2227-7390)</searchLink>. Jan2026, Vol. 14 Issue 2, p327. 27p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=191216853
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        Value: 10.3390/math14020327
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      – Code: eng
        Text: English
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        PageCount: 27
        StartPage: 327
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      – TitleFull: Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.
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            NameFull: Huang, Cheng-Hung
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              Text: Jan2026
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              Y: 2026
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